JPH0431186B2 - - Google Patents

Info

Publication number
JPH0431186B2
JPH0431186B2 JP60295704A JP29570485A JPH0431186B2 JP H0431186 B2 JPH0431186 B2 JP H0431186B2 JP 60295704 A JP60295704 A JP 60295704A JP 29570485 A JP29570485 A JP 29570485A JP H0431186 B2 JPH0431186 B2 JP H0431186B2
Authority
JP
Japan
Prior art keywords
input
output terminals
conductor pads
mounting
flat package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60295704A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62155544A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60295704A priority Critical patent/JPS62155544A/ja
Publication of JPS62155544A publication Critical patent/JPS62155544A/ja
Publication of JPH0431186B2 publication Critical patent/JPH0431186B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60295704A 1985-12-27 1985-12-27 混成集積回路 Granted JPS62155544A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60295704A JPS62155544A (ja) 1985-12-27 1985-12-27 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60295704A JPS62155544A (ja) 1985-12-27 1985-12-27 混成集積回路

Publications (2)

Publication Number Publication Date
JPS62155544A JPS62155544A (ja) 1987-07-10
JPH0431186B2 true JPH0431186B2 (en]) 1992-05-25

Family

ID=17824080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60295704A Granted JPS62155544A (ja) 1985-12-27 1985-12-27 混成集積回路

Country Status (1)

Country Link
JP (1) JPS62155544A (en])

Also Published As

Publication number Publication date
JPS62155544A (ja) 1987-07-10

Similar Documents

Publication Publication Date Title
EP0074816B1 (en) High terminal count integrated circuit device package
EP0142938B1 (en) Semiconductor integrated circuit including a lead frame chip support
JPH0552079B2 (en])
JPS60500111A (ja) 半導体チツプパツケ−ジ
KR20030060882A (ko) 반도체 장치 및 반도체 모듈
US5324985A (en) Packaged semiconductor device
JPH057868B2 (en])
US6329594B1 (en) Integrated circuit package
US3518493A (en) Arrangement for mounting and connecting microelectronic circuits
GB2152753A (en) Decoupling capacitor for integrated circuits and relationship with a printed circuit board
US6467163B1 (en) Universal component mounting structure for surface mountable electronic devices
JPH0431186B2 (en])
JP2645285B2 (ja) 集積回路担持用電気的構成要素
JPH0419788Y2 (en])
JP3033662B2 (ja) 半導体素子実装用フィルムと半導体素子実装構造
JPH05102621A (ja) 導電パターン
JPS6013186Y2 (ja) 電気コネクタ
JP2723514B2 (ja) 半導体装置
JPH06132473A (ja) ハイブリッドｉｃ
JPS6143272Y2 (en])
JP3014937B2 (ja) コネクタ
JPS62155525A (ja) 混成集積回路
EP0831530A2 (en) Integrated dielectric substrate
JPH02866Y2 (en])
JP2919648B2 (ja) 混成集積回路装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees